BS PD IEC TR 62878-2-7:2019
BS PD IEC TR 62878-2-7:2019 Device embedding assembly technology. Guidelines. Accelerated stress testing of passive embedded circuit boards
standard by BSI Group, 04/01/2019
Full Description
BS PD IEC TR 62878-2-7:2019 describes the accelerated stress testing of passive embedded circuitboards. It can be used for screening finished boards, including multilayer and high-densityinterconnection (HDI) boards. These boards are mainly for mobile devices.Cross References:
IEC 60194
All current amendments available at time of purchase are included with the purchase of this document.